TRI-AXIS GEO-MAGNETIC SENSOR DEVICE PACKAGE AND THE METHOD FOR FABRICATING THE SAME

摘要

A package of a tri-axis geo-magnetic sensor and a method for manufacturing the same are provided to reduce a thickness and an area of a chip by using a wire bonding and a solder ball bonding during an assembly of a perpendicular sensor device. A package of a tri-axis geo-magnetic sensor includes a substrate(110), a horizontal sensor device(120) and a perpendicular sensor device(140). The horizontal sensor device and the perpendicular sensor device are mounted on a top surface of the substrate. A mother board is mounted on a bottom surface of the substrate by a solder ball(112). The horizontal sensor device is horizontally mounted on the substrate to sense one or more than one magnetic fields of a horizontal component. The perpendicular sensor includes a structure, a contact pad(143) formed around the structure, and a horizontal protrusion pad(147). The structure includes an inductor component having a magnetic substance and a coil on a wafer.