发明名称 PCB WITH ESD PROTECTION PATTERN AND SEMICONDUCTOR PACKAGE HAVING THE SAME
摘要 A PCB(Printed Circuit Board) having an ESD(Electro-Static Discharge) protection pattern and a semiconductor package having the same are provided to protect internal elements from external ESD by forming the ESD protection pattern along an edge of the PCB. A terminal unit(340) includes a plurality of external connecting terminals including ground terminals which are formed at one side of a PCB. A conductive pattern(330) is formed on one side of the PCB in order to be connected electrically to the ground terminal of the terminal unit. An ESD protection pattern(360) is formed along an edge of one side of the PCB and is disposed to surround the conductive patterns. The electrostatic discharge protection pattern is divided into at least two protection patterns. Each of the protection patterns is electrically connected to the ground terminal.
申请公布号 KR20070077614(A) 申请公布日期 2007.07.27
申请号 KR20060007268 申请日期 2006.01.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAN, CHAN MIN
分类号 H05K9/00 主分类号 H05K9/00
代理机构 代理人
主权项
地址