PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

A printed circuit board and a semiconductor package having the same are provided to obtain high performance by suppressing degradation of adhesive characteristics of a photo-solder resist and an insulating layer. An insulating layer(110) includes terminal pads(161,162) to be connected to external terminals and includes via holes(151,152). A first conductive line(121) is extended from the terminal pads to the via holes in a mesh pattern. A second conductive line(125) is formed on the same plane as the plane of the first conductive line in order to improve a conductive characteristic of the first conductive line. The second conductive line is extended linearly from the terminal pad to the via holes.