| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a chip-type electronic component which is excellent in reliability and does not always become failure even if cracks occur in an insulation substrate. <P>SOLUTION: The chip-type electronic component includes an insulating substrate 11 in a rectangular shape, a pair of upper surface electrode prepared in the vicinity of the facing two sides of the upper surface of the insulation substrate 11, and a resistor (functional element) prepared so as to be electrically connected to the one pair of the upper surface electrode. The dimension of the width of the side edge of the side in which the pair of the upper surface electrode in the insulation substrate 11 is prepared is made so that it is larger in the backside than in the upper side of the insulation substrate 11. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
