| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To downsize a semiconductor chip by effectively laying out an electrode in a semiconductor device of a COF package. <P>SOLUTION: An electrode 2a provided on a semiconductor chip 2 of a COF package is formed with one short side of a rectangle being cut down into a crest shape (in a triangular shape). The electrodes are disposed in a zigzag manner such that the crests are adjacent to each other. This configuration enables adjacent electrodes 2a to be disposed in overlapping, thereby enhancing disposition density of the electrode 2a and reducing the length of the semiconductor chip 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
