METHODS AND APPARATUSES FOR IMPROVED POSITIONING IN A PROBING SYSTEM
摘要
<p>An improved method and apparatus for automatically and accurately aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a multi-loop feedback control system incorporating information from a number of sensors is used to maintain the desired contact position in the presence of disturbances. Other aspects and other embodiments are also described.</p>
申请公布号
WO2007084206(A1)
申请公布日期
2007.07.26
申请号
WO2006US42478
申请日期
2006.10.30
申请人
ELECTROGLAS, INC.;NAYAK, UDAY;ZHANG, XIAOLAN;ASMEROM, GEORGE;JEDDA, MAX
发明人
NAYAK, UDAY;ZHANG, XIAOLAN;ASMEROM, GEORGE;JEDDA, MAX