| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and simply implement connection and isolation among semiconductor devices, and also connection and isolation between a semiconductor device and a circuit board, etc. <P>SOLUTION: The semiconductor device 1 includes semiconductor elements 6, 8 mounted on a wiring circuit board 4. The semiconductor elements 6, 8 are connected with a connection pad 3 of the wiring circuit board 4, for example, via bonding wires 7, 9. The wiring circuit board 4 is provided with external connecting terminal 5 connected to the connection pad 3 via a wiring network. The external connecting terminal 5 has a connection structure that may be loaded or unloaded on the basis of combination of a convex part and a concave part to be connected electrically and mechanically. <P>COPYRIGHT: (C)2007,JPO&INPIT |
