| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attain a multilayer substrate repairing method which can easily repair a crack produced between an outlayer pattern and a via. <P>SOLUTION: The multilayer substrate repairing method repairs a disconnection between an outer layer pattern 4a and via 3a in a multilayer substrate that includes the outer layer pattern 4a, an inner layer pattern 5a, an interlayer insulating layer 6 formed between the outer layer 4a and the inner layer pattern 5a, the via 3a in the interlayer insulating layer 6 covered with the outer layer pattern 4a and the inner layer pattern 5a to connect the outer layer pattern 4a and the inner layer pattern 5a. A hole which reaches the via 3a through the outer layer pattern 4a is formed, a conductive paste is filled into the hole, and the conductive paste filled into the hole is hardened. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
