| 摘要 |
PROBLEM TO BE SOLVED: To enable a machining, an analysis, and tests by preventing a reduction in the accuracy of the relationship between the irradiation position of an electron beam on an end of a sample and the position of the sample. SOLUTION: The semiconductor manufacturing or testing apparatus for irradiating a surface of a semiconductor wafer with electron beams to machine or test the sample, comprising an electrostatic chucking stage for holding the sample. The stage around the sample is almost as high as the surface of the sample when holding the sample. COPYRIGHT: (C)2007,JPO&INPIT
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