| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component which can increase the bulk density of an electrode paste layer to be formed as an internal electrode layer and can less involve problems with the interrupted internal electrode layer, a reduced electrostatic capacity caused by irregular thickness or the like, short-circuit failure, or nonlamination (nonbonding failure). SOLUTION: The method for manufacturing an electronic component having an internal electrode layer comprises steps of forming a green sheet 10a, forming an electrode paste layer 12a to be formed as the internal electrode layer 12, forming a green chip as a laminate with the electrode paste layer 12a and the green sheet 10a, and baking the green chip. Before the electrode paste layer 12a is dried as the internal electrode layer 12, a magnetic force is applied to the electrode paste layer while heated at such a temperature as not to completely dry the electrode paste. COPYRIGHT: (C)2007,JPO&INPIT
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