| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device in which a sealed space fully preventing contamination without forming a recess on a wafer is formed, in a predetermined region to which a semiconductor or MEMS is arranged on the wafer level. SOLUTION: The manufacturing method of the semiconductor device having the sealed space provided with a semiconductor or MEMS comprises a process for forming a photosensitive resin layer in one surface of a cover substrate 10, by applying photosensitive resin to the cover substrate 10; a process for forming spacers 30 consisting of a remainder of a photosensitive resin layer wherein a part of the photosensitive resin layer is removed by photo lithography, and for acquiring a laminate having sealed spaces by sticking the cover substrate 10 on a functional surface of a wafer 50 wherein functional parts 40 provided with semiconductors or MEMSs are formed via spacers 30; and a process for obtaining the above semiconductor device having the sealed space by dividing the laminate having the sealed spaces by dicing. COPYRIGHT: (C)2007,JPO&INPIT
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