| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate cleaning apparatus and a substrate cleaning method which can expose the copper surface with a high uniformity by surely cleaning the surface of a copper member of a substrate and its periphery. SOLUTION: The substrate cleaning apparatus comprises a substrate holding means for holding a substrate, a cuprate-removing chemical supply means for supplying a chemical which has a high etch selectivity with respect to copper and selectively removes a cuprate by etching, an oxidant supply means for supplying an oxidant having an action of oxidizing copper onto the surface of the substrate, and a pure water supply means for supplying pure water for water washing onto the surface of the substrate. COPYRIGHT: (C)2007,JPO&INPIT
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