| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, by which an adhesion between an insulating layer and a conductor circuit in the multilayer wiring board to carry out a face-down packaging of a semiconductor chip can be improved, a peeling between the conductor circuit and the insulating layer during a processing process can be reduced, and a fine wiring can be formed. SOLUTION: The method of manufacturing the multilayer wiring board comprises the steps of: forming the insulating layer including a porosity inorganic filler on a front surface of a circuit board composed of an insulating substrate in which the conductor circuit is formed; and exposing the porosity inorganic filler on a front surface of the insulating layer by oxidizing roughening liquid. COPYRIGHT: (C)2007,JPO&INPIT |
