| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a via hole conductor of a multilayer ceramic electronic component which can remarkably reduce the number of processing steps, has excellent electric connection between an internal electrode and the via hole conductor, and can form the minute via hole conductor, and to provide a capacitor employing the same. SOLUTION: An electronic component is manufactured by a method including a step of preparing a laminate obtained by laminating a plurality of ceramic green sheets having conductor films as a wiring pattern formed on its surface, and containing a binder resin; a step of irradiating a predetermined position of the laminate with a laser beam to cut molecular chains of an organic compound constituting the binder resin; a step of sucking one part of the laminate irradiated with a laser beam from one side irradiated with the laser beam simultaneously with irradiation of the laser beam, thereby removing the one part to form a through hole in a laminating direction of the laminate; and a step of filling the through hole with a conductive paste. COPYRIGHT: (C)2007,JPO&INPIT
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