发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method a high drive current, a transmission conductance, and a sub-threshold characteristic can be improved and a floating body potential effect can be restrained, while suppressing increase in the parasitic capacitance, between the drain and the channel and increase in the sub-threshold leakage current due to DIBL effect. SOLUTION: In the semiconductor device, an SOI-MOSFET 1 has a heavily-doped diffusion region 17c, formed in a support substrate 11a, a heavily-doped diffusion region 17d, formed in the support substrate 11a to be deeper than the heavily-doped diffusion region 17c, and a gate electrode 14 formed on the heavily-doped diffusion region 17c. Furthermore, the SOI-MOSFET 1 has a drain region 15d, formed in an SOI layer 11c on the heavily-doped diffusion region 17d, and a source region 15s formed in the SOI layer 11c, on a side opposite to the drain region 15d, sandwiching below the gate electrode 14. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007188992(A) 申请公布日期 2007.07.26
申请号 JP20060004485 申请日期 2006.01.12
申请人 OKI ELECTRIC IND CO LTD 发明人 ANIL KUMAR
分类号 H01L29/786;H01L21/336;H01L29/423;H01L29/49 主分类号 H01L29/786
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