发明名称 METHOD OF CONSTRUCTING CONDUCTIVE FLOORING
摘要 PROBLEM TO BE SOLVED: To provide a method of easily constructing conductive flooring with excellent antistatic performance. SOLUTION: A plurality of floor materials each having a film layer for surface material of 10<SP>9</SP>Ωor less in surface resistance are arranged on a floor and adhered to a floor backing material. A joint filler of 10<SP>9</SP>Ωor less in resistance value is so filled in the clearances between the floor materials that the joint filler comes into contact with both the film layers for the surface materials and the floor backing material. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007186853(A) 申请公布日期 2007.07.26
申请号 JP20060003719 申请日期 2006.01.11
申请人 TAISEI CORP 发明人 WAKAYAMA YOSHIHIDE;IMAFUKU MASAYUKI;KOBAYASHI SADAO
分类号 E04F15/18 主分类号 E04F15/18
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