摘要 |
PROBLEM TO BE SOLVED: To provide a method of easily constructing conductive flooring with excellent antistatic performance. SOLUTION: A plurality of floor materials each having a film layer for surface material of 10<SP>9</SP>Ωor less in surface resistance are arranged on a floor and adhered to a floor backing material. A joint filler of 10<SP>9</SP>Ωor less in resistance value is so filled in the clearances between the floor materials that the joint filler comes into contact with both the film layers for the surface materials and the floor backing material. COPYRIGHT: (C)2007,JPO&INPIT
|