发明名称 METHOD FOR MANUFACTURING SOLDER CLAD MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for stably manufacturing a solder clad material in which solder is thickly laminated on a base material. SOLUTION: A laminate composed of three layers is obtained by laminating a solder on one side face of a base material which consists of an iron-based alloy or copper/copper alloy, and laminating a dummy material on the other side face of the base material. A clad material consisting of the base material and the solder is obtained by rolling the laminate and then separating the dummy material from the base material. The thickness of the solder before the rolling to that of the base material is preferably controlled so that the thickness of the solder after the rolling becomes thicker than that of the base material after the rolling. Further, it is preferable to use the dummy material which has rigidity higher than the base material has. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007185688(A) 申请公布日期 2007.07.26
申请号 JP20060005643 申请日期 2006.01.13
申请人 SUMITOMO METAL MINING CO LTD 发明人 SUESHIGE YOSHITAKA
分类号 B23K35/40 主分类号 B23K35/40
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