FLIP-CHIP-VERBINDUNG MIT NICHTLEITENDEM KLEBMITTEL

摘要

PCT No. PCT/EP95/01388 Sec. 371 Date Apr. 10, 1997 Sec. 102(e) Date Apr. 10, 1997 PCT Filed Apr. 13, 1995 PCT Pub. No. WO96/05614 PCT Pub. Date Feb. 22, 1996The invention concerns flip chip technology using non-conductive adhesives and gold ball bumps or connectors. The concept is to simultaneously attach and interconnect bare chips with gold ball bumps to organic substrates. The chip is fixed by cooling the insulative adhesive. Environmental testing has demonstrated that performance characteristics were acceptable after 1000 hours of continuous exposure to humidity, and were excellent after 1000 temperature cycles. Such stable interconnections can only be realized by the compliance of the flip chip joint. This stability, can be achieved by precise control of the bonding parameters such as temperature and pressure. This bonding technique allows quality attachment of bare chips on low cost organic substrates.