发明名称 CONDUCTIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a conductive resin composition providing a molded article not only excellent in a delustering property, coating adhesiveness and coating clarity after coating, but also low in a coefficient of linear expansion. SOLUTION: The resin composition comprises a polyamide (A), a polyphenylene ether (B) and a block copolymer (C) comprising at least one aromatic vinyl polymer block consisting essentially of an aromatic vinyl monomer unit and at least one conjugated diene polymer block consisting essentially of a conjugated diene monomer unit, a conductive carbonaceous material (D) and wollastonite particles (E). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007186704(A) 申请公布日期 2007.07.26
申请号 JP20070026883 申请日期 2007.02.06
申请人 ASAHI KASEI CHEMICALS CORP 发明人 MIYOSHI TAKAAKI;NODA KAZUYA;HORIO MITSUHIRO;YOSHINAGA YUJI
分类号 C08L77/00;C08J3/22;C08K3/04;C08K7/10;C08L53/02;C08L71/12;H01B1/24 主分类号 C08L77/00
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