发明名称 A REMOVE DEVICE FOR BUBBLE
摘要 A bubble-removing apparatus for manufacturing a PCB(Printed Circuit Board) is provided to remove the bubbles mixed in a solvent by generating a centrifugal force through the rotation of a brush in the solvent in a tank. A bubble-removing apparatus for manufacturing a PCB includes a tank(10), substrates(25), nozzles(23), an overflow pipe, a vessel(30), a brush(41), a circulating hole, a cylinder net, and a ring-shaped guide. The tank(10) has a solvent inside. The substrates(25) are placed and moved on a conveyer mounted at the upper part inside the tank(1). The nozzles(23) are coupled at the front end of a supply pipe(22) coupled at a drain port of a pump(20) connected to the tank(10), and injects the solvent at the substrates(25). The overflow pipe is connected at one side of the tank(10). The vessel(30) is mounted inside the tank(10), and the upper part thereof is formed higher than a water level to introduce the bubbles floating on the water inside the vessel(30). The brush(41) is coupled at a rotating axis(40a) of a motor(40) mounted at the top surface of the tank(10), and is placed inside the vessel(30) to destroy the bubbles introduced into the vessel(30). The circulating hole is formed at the bottom of the vessel(30) to circulate the solvent stored in the tank(10). The cylinder net is installed inside the vessel(30) to rotate the brush(41) inside the cylinder net. The ring-shaped guide with a slant at each side is installed at the upper circumference of the vessel(30).
申请公布号 KR100745213(B1) 申请公布日期 2007.07.26
申请号 KR20060109928 申请日期 2006.11.08
申请人 HONG, WON KI;HONG, DA YOUNG;HONG, MYUNG JI;HONG, SEOK HO 发明人 HONG, WON KI;HONG, DA YOUNG;HONG, MYUNG JI;HONG, SEOK HO
分类号 H05K13/00 主分类号 H05K13/00
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