| 摘要 |
A semiconductor chip carrier is provided to prevent breakage of a semiconductor chip by preventing malfunction of a latch due to dust accumulation at test of the semiconductor chip. A base(10) has an opening(11), a contact opening(12) communicating with the opening at a bottom surface thereof, and a semiconductor mounting surface(13) enclosing the contact opening. Two leaf springs(20) are made of plate-shaped protrusion portions(12), in which one end of the spring is fixed to the base and the other end protrudes from a center of the opening of the base. A driving unit(30) deforms the leaf spring so that the other end of the spring does not protrude. The driving unit is a plate-shaped member connected to an upper surface of the base through an elastic member.
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