| 摘要 |
PROBLEM TO BE SOLVED: To provide a visual inspection system for a semiconductor capable of specifying the flaw having increased or disappeared before and after a predetermined process of a semiconductor manufacturing process; a visual inspection method; and a semiconductor manufacturing apparatus. SOLUTION: The visual inspection system 20 of the semiconductor, which detects the flaw present on the sample 2 on the basis of the image acquired by photographing the surface 2 of the sample to which a predetermined processing is applied in the semiconductor manufacturing apparatus 1, is equipped with a flaw detection part 28 for detecting the flaw in one of the images captured before and after the predetermined processing and an image extraction part 32 for extracting the image of a flaw place detected by the flaw detection part 28 from the other one of images captured before and after the predetermined processing. COPYRIGHT: (C)2007,JPO&INPIT
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