| 摘要 |
PROBLEM TO BE SOLVED: To reduce cracking and breakage of a silicon substrate due to a bite of a foreign substance into the gap between bonded substrates, i.e. an electrode substrate and a silicon substrate. SOLUTION: An electrode substrate and a silicon substrate which includes at least a chamber for storing and ejecting liquid are bonded while opposing through a gap, and a liquid channel including the ejection chamber and a portion serving as an electrode extraction opening corresponding to the joint of the electrode to an external apparatus are formed in the silicon substrate bonded to the electrode substrate. In the process for manufacturing such a droplet ejection head, a plurality of electrode forming grooves 9 are formed in the surface of a glass substrate 2, end portion of the glass substrate 2 is formed to have a surface 11 recessed from the surface where the electrode forming grooves 9 are formed, a plurality of electrodes 8 are formed to extend from the electrode forming grooves 9 to the recessed surface 11 by depositing a film, and an electrode substrate 2A where the electrode 8 formed on the recessed surface 11 by depositing a film serves as an electrode terminal 8b for connection with an external apparatus is employed as the electrode substrate of the droplet ejection head. COPYRIGHT: (C)2007,JPO&INPIT
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