发明名称 |
RF module, multi RF module including the RF module, and method of manufacturing the RF module |
摘要 |
A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.
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申请公布号 |
US2007170565(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
US20060634247 |
申请日期 |
2006.12.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG SEOG-WOO;SONG IN-SANG;HA BYEONG-JU;PARK HAE-SEOK;HWANG JUN-SIK;LEE JOO-HO |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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