发明名称 RF module, multi RF module including the RF module, and method of manufacturing the RF module
摘要 A radio frequency (RF) module and a multi RF module including the same include a base substrate, a first element capable of processing RF signals formed on the base substrate, a second element capable of processing RF signals separated from and disposed over the first element, a cap substrate coupled with the base substrate to encapsulate the first and second elements including a plurality of through electrodes that electrically connect the first and second elements to the outside, and a bonding pad that encapsulates and joins the base substrate and the cap substrate and electrically connects the first and second elements to the through electrodes.
申请公布号 US2007170565(A1) 申请公布日期 2007.07.26
申请号 US20060634247 申请日期 2006.12.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG SEOG-WOO;SONG IN-SANG;HA BYEONG-JU;PARK HAE-SEOK;HWANG JUN-SIK;LEE JOO-HO
分类号 H01L23/02 主分类号 H01L23/02
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