| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means for improving various characteristics of frequency response of an interconnect system. <P>SOLUTION: In an interconnect system for providing access to a common I/O terminal for multiple circuit devices, each device is provided with a separate contact pad within an IC. The contact pads are connected to one another and to the IC I/O terminal through inductive conductors such as bonding wires, metal coating pattern in the IC, or legs of a two-forked spring contact part formed on the IC by lithographic printing. Further the ESD protection function is distributed among multiple ESD devices interconnected by series inductors to provide a multi-pole filter at each IC terminal. The inductances of the conductors and various capacitances of the interconnect system are appropriately adjusted to optimize a frequency response characteristics of the desired interconnect system. <P>COPYRIGHT: (C)2007,JPO&INPIT |
