| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that solves a problem of reflection of a pattern of a wiring formed on a back surface of a semiconductor substrate on an outputted image. <P>SOLUTION: A reflection layer 8 is formed between a light receiving element 1 and a wiring layer 10 for reflecting an infrared ray toward a light receiving element 1, without transmitting it to the wiring layer 10. The infrared ray enters from a light transparent substrate 6 toward the wiring layer 10 through a semiconductor substrate 2. The reflection layer 8 may also be formed at least in a region under the light receiving element 1 uniformly, or only under the light receiving element 1. Alternatively, instead of the reflection layer 8, an anti-reflection layer 30 having a function of absorbing the entering infrared ray to prevent transmission thereof may be formed. <P>COPYRIGHT: (C)2007,JPO&INPIT |
