| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric device which is not broken by injection pressure during resin molding even if a bottom plate constituting a package of a piezoelectric vibrator is made thin. SOLUTION: The piezoelectric device has a package 21 containing a piezoelectric vibration chip 40 and an IC 30 fixed on the reverse surface of the package 21, the package 21 and IC 30 molded with resin 12. In this case, the IC 30 which is employed has a die size which is sufficiently large to straddle reverse surfaces at positions corresponding to opposed side walls 22a and 22a constituting a cavity 24 of the package 21 for storing the piezoelectric vibration chip 40, and is arranged straddling the reverse surfaces. COPYRIGHT: (C)2007,JPO&INPIT
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