| 摘要 |
The invention relates to an apparatus for degassing a wafer-like substrate (10) in an evacuated environment having two essentially flat, parallel bodies (11, 12) which are at a distance (d) which is shorter than their longitudinal extent (1) to form an interspace (28), the substrate (10) being arranged between the bodies (11, 12) and having these at least projecting over it in the edge region, where at least one of the bodies (11, 12) contains a gas supply line (13) for producing a laminar flow of gas in the interspace (28) along the bodies (11, 12) and the substrate (10) in a radial direction relative to the periphery of the bodies (11, 12), and where this point is provided with a pump opening (14) for pumping away the flow of gas. |
