| 摘要 |
PROBLEM TO BE SOLVED: To provide an external electrode formation method for an electronic component that can securely form external electrodes. SOLUTION: The present external electrode formation method includes a paste preparation step S01 that prepares a jig having a groove inclined to the outside in a direction where at least the side wall heads off to an opening side from the back side, the groove into which a chip composing an electronic component can be inserted, and fills conductive paste into the groove, a removal step S02 that leaves the filled conductive paste behind at least along the side wall and removes the remnant, a device preparation step S03 that arranges the chip right above the groove part, a contact step S04 that inserts the chip into the groove and moves it toward the side wall so as to bring its ridge line into contact with the side wall, and a formation step S05 that separates the chip from the side wall such that the ridge line comes off the side wall. COPYRIGHT: (C)2007,JPO&INPIT |
