| 摘要 |
A component-containing module includes a module substrate having first wiring lines provided on the top surface of the module substrate, a first circuit component mounted on the first wiring lines of the module substrate, a submodule substrate having an area smaller than the area of the module substrate and mounted on the first wiring lines of the module substrate at a position at which the first circuit component is not mounted, a second circuit component mounted on second wiring lines provided on the top surface of the submodule substrate, and an insulating resin layer provided on the entire top surface of the module substrate so as to encompass the first circuit component, the second circuit component, and the submodule substrate.
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