发明名称 Microcontact printed thin film capacitors
摘要 The invention relates to thin film single layers, electronic components such as multilayer capacitors which utilize thin film layers, and to their methods of manufacture. Chemical solution deposition and microcontact printing of dielectric and electrode layers are disclosed. High permittivity BaTiO<SUB>3 </SUB>multilayer thin film capacitors are prepared on Ni foil substrates by microcontact printing and by chemical solution deposition. Multilayer capacitors with BaTiO<SUB>3 </SUB>dielectric layers and LaNiO<SUB>3 </SUB>internal electrodes are prepared, enabling dielectric layer thicknesses of 1 mum or less. Microcontact printing of precursor solutions of the dielectric and electrode layers is used.
申请公布号 US2007172592(A1) 申请公布日期 2007.07.26
申请号 US20050262524 申请日期 2005.10.28
申请人 KEMET CORPORATION 发明人 TROLIER-MCKINSTRY SUSAN;RANDALL CLIVE A.;NAGATA HAJIME;PINCELOUP PASCAL G.;BEESON JAMES J.;SKAMSER DANIEL J.;RANDALL MICHAEL S.;TAJUDDIN AZIZUDDIN
分类号 B05D5/00;B05D3/08 主分类号 B05D5/00
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