发明名称 LIQUID EPOXY RESIN COMPOSITION AND ADHESIVE USING SAME
摘要 <p>Disclosed is a liquid epoxy resin composition containing at least an epoxy resin and a curing agent. The liquid epoxy resin composition is characterized in that the adhesion strength (A) after curing the composition for 60 seconds at 150°C and the adhesion strength (B) after curing the composition for 1 hour at 150°C satisfy the following relation: 0.6B &lt; A. Also disclosed is an adhesive containing a liquid epoxy resin composition which is preferably characterized in that the adhesion strength (A) after curing the composition for 60 seconds at 150°C and the adhesion strength (B) after curing the composition for 1 hour at 150°C satisfy the following relation: 0.6B &lt; A.</p>
申请公布号 WO2007083673(A1) 申请公布日期 2007.07.26
申请号 WO2007JP50614 申请日期 2007.01.17
申请人 SOMAR CORPORATION;TANIGUCHI, MASA;WATANABE, YUICHI;KIKUCHI, HIDEKI;MATSUMURA, YASUO 发明人 TANIGUCHI, MASA;WATANABE, YUICHI;KIKUCHI, HIDEKI;MATSUMURA, YASUO
分类号 C08G59/00;C09J163/00 主分类号 C08G59/00
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