SLURRY APPLYING APPARATUS

摘要

A slurry supply apparatus is provided to minimize the amount of a wasted slurry and to improve the uniformity of polishing on a wafer by using a plurality of movable nozzles. A slurry supply apparatus includes a slurry mixing bath, a slurry arm, a slurry supply unit. The slurry mixing bath(130) are used for forming a slurry compound by mixing slurry and wet nitrogen gas with each other. The slurry arm(140) is connected with a slurry supply line, wherein the slurry supply line is branched from the slurry mixing bath. The slurry arm is capable of performing translational motion on a polishing pad. The slurry supply unit(150) is installed at one end portion of the slurry arm. The slurry supply unit is composed of a plurality of movable nozzles capable of spraying the slurry compound onto the polishing pad.