| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable multilayer printed board which hardly receives the effect of a processing method for an inner layer circuit board, the inner layer circuit board, and a copper foil grade using the inner layer circuit board; offers superior peeling strength between a resin and the copper foil and heat resistance; and, particularly, meets a demand for high peeling strength. SOLUTION: The processing method for the inner layer circuit board used for the multilayer printed board includes a process of roughing by blast the surface of a copper circuit formed on the inner layer circuit board, and consecutively roughing by immersion the surface of a copper circuit using a chemical roughing solution. COPYRIGHT: (C)2007,JPO&INPIT |
