| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board where electrostatic destruction can effectively be prevented while malfunction of a device is prevented. SOLUTION: A chrome thin film 7 is formed on a whole surface of a cover insulating layer 5 of a suspension substrate with circuit 1, and on a whole surface of a conductor layer 4 of a terminal part 6 by a sputtering method; and a chrome oxide layer 8 is formed on a surface of the chrome thin film 7 by oxidizing the surface by heating or by the sputtering method. Since a semiconductor layer 9 formed of the chrome thin film 7 and the chrome oxide layer 8 is formed on the surface of the cover insulating layer 5, destruction of a mounting component by static electricity and malfunction of the device can be prevented which occurs when only the chrome thin film 7 is formed. The semiconductor layer 9 whose surface resistivity is uniform and suitable can be formed on the surface of the cover insulating layer 5, compared to a case when the chrome oxide layer 8 is directly formed by a reactant sputtering method and the sputtering method using a metal oxide target. COPYRIGHT: (C)2007,JPO&INPIT
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