| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer which secures a device region maximally and reducing the area of an outer peripheral surplus region for forming crystal orientation recognition mark, while being optimum for the recognizing method of a reflection type mark. SOLUTION: In the semiconductor wafer having the outer peripheral surplus region 5 on the circumference of the device region 4, an elliptical flat surface orthogonal to the front surface is formed as the mark 8 showing the crystal orientation in the region of rounding part 7 of an outer peripheral end. The notching amount of the mark 8 toward the inside of a diametral direction is made extremely small to reduce the width of the outer peripheral surplus region 5, and to expand the device region 4 to increase the amount of production of the device (semiconductor chip) per one sheet. COPYRIGHT: (C)2007,JPO&INPIT
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