发明名称 |
Semiconductor apparatus manufacturing method |
摘要 |
The semiconductor apparatus includes a semiconductor chip, and a source electrode and a gate electrode which are formed on the semiconductor chip and electrically connected with a lead frame. The source electrode is electrically connected with the lead frame by being laser-welded with a thin-film shaped connecting portion formed at an end of the lead frame. This enables the provision of a semiconductor apparatus with enhanced productivity and yields which exhibits high electrical operability and reliability.
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申请公布号 |
US2007172980(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
US20070650495 |
申请日期 |
2007.01.08 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
TANAKA TAKEKAZU;TAKAHASHI KOUHEI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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