| 发明名称 |
Padless die support integrated circuit package system |
| 摘要 |
An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
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| 申请公布号 |
US2007170555(A1) |
申请公布日期 |
2007.07.26 |
| 申请号 |
US20060339176 |
申请日期 |
2006.01.23 |
| 申请人 |
CAMACHO ZIGMUND R;BATHAN HENRY D;TRASPORTO ARNEL;PUNZALAN JEFFREY D |
发明人 |
CAMACHO ZIGMUND R.;BATHAN HENRY D.;TRASPORTO ARNEL;PUNZALAN JEFFREY D. |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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