| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve a lower height of a piezoelectric device. <P>SOLUTION: The piezoelectric device is provided with a crystal resonation element 12, an IC chip 3, a package 2 having a through-hole 5 capable of housing the crystal resonation element 12 and the IC chip 3, and a lid member 10 for sealing one of openings of the through-hole 5. The IC chip 3 is arranged on the other opening of the through-hole 5, and the inside of the through-hole 5 is hermetically sealed. In this way, the thickness of the IC chip 3 is included in a stopping portion of the through-hole 5. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
