| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet base material with which a protective resin can be efficiently injected into a cavity capable of housing an integrated circuit element utilizing the cavity to the maximum to form an underfil, and to provide a piezoelectric device using the same. SOLUTION: Since the side surface 6 of the cavity 20 has an opening 11, it can house a larger integrated circuit element 5 compared to a closed cavity. Further, a sheet base material 30 can be obtained with which the protective resin 12 for forming the underfil 13 can be injected from a portion interlocking to the opening 11 into the plurality of cavities 20. COPYRIGHT: (C)2007,JPO&INPIT
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