SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND DICING BLADE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of inhibiting the corrosion of a pad electrode, to provide a dicing blade, and to provide a manufacturing method for the semiconductor device.

SOLUTION: A first interlayer insulating film 11 and a second interlayer insulating film 13 are formed on a semiconductor substrate 10. Sets of first Cu wiring 12 are formed in the first interlayer insulating film 11 and sets of second Cu wiring 14 in the second interlayer insulating film 13. The pad electrodes 18 are formed on the sets of second Cu wiring 14 through barrier metals 17. The pad electrodes 18 are composed of AlCu containing Mg.

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