| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can withstand plural wafer test steps. <P>SOLUTION: The semiconductor device is provided with a test objective circuit 1, a test non-objective circuit 2, a first pad group to be used for the test objective circuit 1, and a second pad group to be used for the test non-objective circuit 2. The first pad group includes at least a plurality of divided pads, and the second pad group is comprised of one pad, respectively. <P>COPYRIGHT: (C)2007,JPO&INPIT |
