| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus, capable of maintaining the treatment region of a semiconductor substrate at a high temperature and maintaining the uniformity of the temperature distribution in the treatment region, even if the sealing member for sealing the treatment container is cooled by a cooling means. SOLUTION: This heat treatment apparatus comprises a treatment vessel 2a, whose interior is heated for heat treatment, a lower lid member 2b for closing the opening formed at the lower part of the treatment vessel 2a, a heater 3 for heating the treatment vessel 2a from the outside surface or the upper surface thereof, or from both of the outside surface and the upper surface, a substrate-loading base 4, which is provided inside the treatment vessel 2a and on which the semiconductor substrate is load as the heat treatment object, a sealing member 7 provided at the joint between the treatment vessel 2a and the lower lid member 2b, and a cooling means 12 for cooling the sealing member 7. Furthermore, it comprises a heat-retaining heater for heating the substrate loading base 4, which is arranged under the substrate-loading base 4. COPYRIGHT: (C)2007,JPO&INPIT
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