| 摘要 |
PROBLEM TO BE SOLVED: To eliminate film peeling and to appropriately make Al wiring into multiple layers when a photosensitive organic film is used for an interlayer insulating film. SOLUTION: When multilayer wiring is manufactured on a silicon substrate by using the photosensitive organic film in the interlayer dielectric of an Al wiring layer 13, either of depositing pressure, substrate heating or heat treatment after depositing as a depositing condition of the Al film by sputtering when forming the Al wiring layer 13 is controlled so that the surface of the Al film becomes roughness of an unevenness shape, where a surface area increases. When the photosensitive organic film is formed on the Al wiring layer 13, both contact areas are increased, and both adhesivenesses are improved. Thus, film peeling of the photosensitive organic film is eliminated. COPYRIGHT: (C)2007,JPO&INPIT
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