| 摘要 |
PROBLEM TO BE SOLVED: To provide an analysis method and an analysis program of wafer map data which can easily classify failure types into a system failure and a random failure. SOLUTION: From the wafer map data 30 which shows whether an effective chip area passed a test or not, one of defective chip coordinates is selected with a test data "1". A judgement area 32 consisting of a plurality of chip coordinates which are adjacent to the selected defect chip coordinates 31 is set up. When the test data of the judgement area 32 are all "1", the failure type of the defective chip coordinates 31 is determined as a system failure, and in the other cases, the failure type of the defective chip coordinates 31 is determined as a random failure. In addition, with the other area than the effective chip area virtually set to "1", the failure type is determined for all the defective chip coordinates within the effective chip area including the edge. COPYRIGHT: (C)2007,JPO&INPIT
|
