| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electrode substrate capable of preventing chipping due to processing of a through-hole when an electrode is formed on a glass substrate to make the electrode substrate after the through-hole such as an ink supply hole is processed to be formed on the glass substrate. SOLUTION: This method for manufacturing the electrode substrate comprises a step of drilling the ink supply hole 23 on the glass substrate 2a, and then sequentially laminating an etching protection film 51 and a dry film resist 71 on one face of the glass substrate 2a having the ink supply hole 23, a step of carrying out patterning by photolithography in alignment with a groove shape for forming the etching protection film 51, a step of forming a groove 21 on the surface of the glass substrate 2a by dipping the glass substrate 2a with the ink supply hole 23 and the etching protection film 51 patterned thereon to an etching liquid, and a step of forming the electrode 22 in the groove 21 by forming a film of a conductive material on the glass substrate 2a. COPYRIGHT: (C)2007,JPO&INPIT
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