Semiconductor module, has semiconductor chip stack arranged on wiring substrate, where heat conducting layer e.g. foil with anisotropic heat conducting particles is arranged between semiconductor chips

摘要

The semiconductor module has a semiconductor chip stack (2) arranged on a wiring substrate (3), where a heat conducting layer e.g. a foil (19) with anisotropic heat conducting particles is arranged between semiconductor chips (4,5). The layer has anisotropic heat conducting particles in vertical direction to the layer and/or foil and lower heat conductivity towards the layer and/or the foil. Independent claims are also included for the following: (1) foil for heat dissipation of semiconductor chip stack (2) method for the production of a semiconductor module.