发明名称 |
POLYIMIDE RESIN COMPOSITION AND METAL POLYIMIDE LAMINATE |
摘要 |
<p>Disclosed is a polyimide resin adhesive containing (a) a solvent-soluble polyimide and (b) at least one of alkylated melamine resins and alkylated urea resins. Also disclosed is a metal polyimide laminate obtained by using such a polyimide resin adhesive. The polyimide resin adhesive enables to form a laminate which exhibits high metal foil peel strength, while having adequate heat resistance and flame retardance. Also disclosed are a metal polyimide laminate using such a polyimide resin adhesive and a printed wiring board using such a metal polyimide laminate.</p> |
申请公布号 |
WO2007083623(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
WO2007JP50489 |
申请日期 |
2007.01.16 |
申请人 |
ASAHI KASEI KABUSHIKI KAISHA;MATSUURA, KOYA |
发明人 |
MATSUURA, KOYA |
分类号 |
C09J179/08;B32B15/08;B32B15/088;C09J161/24;C09J161/28;H05K1/03 |
主分类号 |
C09J179/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|