发明名称 POLYIMIDE RESIN COMPOSITION AND METAL POLYIMIDE LAMINATE
摘要 <p>Disclosed is a polyimide resin adhesive containing (a) a solvent-soluble polyimide and (b) at least one of alkylated melamine resins and alkylated urea resins. Also disclosed is a metal polyimide laminate obtained by using such a polyimide resin adhesive. The polyimide resin adhesive enables to form a laminate which exhibits high metal foil peel strength, while having adequate heat resistance and flame retardance. Also disclosed are a metal polyimide laminate using such a polyimide resin adhesive and a printed wiring board using such a metal polyimide laminate.</p>
申请公布号 WO2007083623(A1) 申请公布日期 2007.07.26
申请号 WO2007JP50489 申请日期 2007.01.16
申请人 ASAHI KASEI KABUSHIKI KAISHA;MATSUURA, KOYA 发明人 MATSUURA, KOYA
分类号 C09J179/08;B32B15/08;B32B15/088;C09J161/24;C09J161/28;H05K1/03 主分类号 C09J179/08
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