| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stage device that can expose a wafer by an exposure device in a state of a wafer deformed into a concave wafer or convex wafer without stressing the wafer. <P>SOLUTION: The exposure stage device is usable for various exposure devices, and an exposure stage used for an exposure device is constituted by providing a fine adjustment section 130, capable of tilting the deformed wafer 60 deformed into the concave wafer or convex wafer as a substrate to be exposed, vertically along both an X axis and a Y axis on a reverse surface of a substrate holder 150. The fine adjustment section 130 is configured to use displacement by a driving system of a screw mechanism or a piezoelectric element, and provided so that a movement (displacement) quantity is brought under computer control. The substrate holder 150 provided with the fine adjustment section 130 is mounted on the exposure stage 100 and the substrate holder 150 while stepping bit by bit is adjusted in height and tilted to always maintain a fixed interval difference, so that an irradiation place of the deformed wafer 60 to be exposed is horizontal to an irradiation system 90. The exposure stage device 100 is an exposure stage device configured to move along the X axis, the Y axis, and a Z axis. <P>COPYRIGHT: (C)2007,JPO&INPIT |
