| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting film including a thin built-in light emitting element through reduction in manufacturing cost thereof, by conducting soldering of the light emitting element using a reflow furnace. <P>SOLUTION: The light emitting film having the built-in light emitting element includes heat resistant films of multiple pieces having formed conductive portions on the surfaces thereof, multiple light emitting elements bonded to the conductive portions, and an underlayer film to which the heat resistant films of multiple pieces are adhered. Moreover, a method for manufacturing the light emitting film including the built-in light emitting element includes the steps of adhering a conductive foil to the heat resistant film, forming a conductive portion by etching the surface in the side of the conductive foil, adhering the solder to a part of the conductive portion, placing the light emitting element on the solder, bonding the heat resistant film and the light emitting element by fusing the solder, and adhering the underlayer film to the heat resistant films of multiple pieces. <P>COPYRIGHT: (C)2007,JPO&INPIT |
